Gerätedetails

Twist and bow measurement of substrates and components during a solder cycle.

• Possible objects: printed circuit boards, BGA; QFP, DCB; (additional on request)
• Max. object size 200 mm *150 mm
• Simultaniously measurement of smaller objects possible
• Max. temperature 260°C
• Heating modes: infrared radiation (max. ramp 2 K/s) and simulated convection (0,25 K/s)
• Measurement resolution in z-direction 1 µm
• Max. repeatability 2,5 µm (object dependent)