Gerätedetails

Thermoiré
PS 88
Measurement equipment
Diagnostics
Geometr. characterisation
Akrometrix
(kein Bild verfügbar - no image available)

Twist and bow measurement of substrates and components during a solder cycle.

  • Possible objects: printed circuit boards, BGA; QFP, DCB; (additional on request)
  • Max. object size 200 mm *150 mm
  • Simultaniously measurement of smaller objects possible
  • Max. temperature 260°C
  • Heating modes: infrared radiation (max. ramp 2 K/s) and simulated convection (0,25 K/s)
  • Measurement resolution in z-direction 1 µm
  • Max. repeatability 2,5 µm (object dependent)
Wohlrabe, Heinz, Dr.-Ing. habil.
T: (0351) 463 35479
WHB E54

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