Gerätedetails

Wave soldering equipment
GoWave
Soldering equipment
Soldering
Mass soldering
SEHO Systems GmbH

Wave soldering of assembled SMD and THT devices

  • Max. PCB size (L/B/H): 400 mm * 290 mm * 100 mm
  • Single wave system with Wörthmann wave and notrogen flooding
  • Currently ussed solder Stannol Sn100C (SnCu0,7NiGe), melting point 227°C / soldering temp. typ.  265°C)
  • One-step pre-heating with infrared radiation
  • Spraying flux unit with currently used flux Stannol EF 350
  • Pass-through speed 0,5..15 cm/min
Wohlrabe, Heinz, Dr.-Ing. habil.
T: (0351) 463 35479
WHB E61

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