Gerätedetails

Wedge-wedge bonding with Al, Au, Cu, Ag bonding wires

• Processing of aluminum and gold wires, d=(17.5…75) µm
• Bonding programs: manually, semi-automatic, automatic, multi-wire, step mode
• Loop forms: rectangel, single & double reverse, stitch
• Programable bond parameters:
  • Ultrasonic power, f=100 kHz (high, low) P=(0…5) W
  • Bonding force, F=(15…150) cN
  • Bonding time
• Working area bonding head
  • Y-axis 50 mm, Z-axis 50 mm, 2.5 µm resolution
  • Working space in height 136 mm
  • X/Y manipulator 5x5 mm up to 18x18 mm
• Different specimen holder available
  • Specimen holder with mechanical fixing of the substrate
  • Specimen holder with vacuum supply