Equipment Details

Spin coater
Spin Processor Laurell WS-650Mz-8NPP
Spin coater
Coating
Layer deposition
Laurell Technologies Corp.
(kein Bild verfügbar - no image available)

Spin coating - application of thin and smooth layers on a substrate for lithography in the field of advanced packaging, 3D packaging, MEMS, interposer technologies, photovoltaic, nanotechnology as well as wafer and board level optics

  • 318 mm Process Chamber (NPP)
  • Substrates: 200 mm (8“ wafer) or 178 mm x 178 mm (7“x7“, rect. substrates)
  • Vacuum chucks:
    • 200 mm for diam. 100 mm through diam. 200 mm
    • 45 mm for diam. 50 mm through diam. 150 mm
    • fragment chuck adapter for small pieces substrates – 10 mm – 50 mm
  • Manual material dispensing:
    • triple syringe adapter (5 ml)
    • syringe adapter for EBR (Edge Bead Removal)
  • Speed up to 12k rpm
  • Acceleration up to 13k rpm
  • Suitable for puddle development
Nieweglowski, Krzysztof, Dr.-Ing.
T: (0351) 463 35291
WHB 157

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