Equipment Details

Spin coating - application of thin and smooth layers on a substrate for lithography in the field of advanced packaging, 3D packaging, MEMS, interposer technologies, photovoltaic, nanotechnology as well as wafer and board level optics

• 318 mm Process Chamber (NPP)
• Substrates: 200 mm (8“ wafer) or 178 mm x 178 mm (7“x7“, rect. substrates)
• Vacuum chucks:
  • 200 mm for diam. 100 mm through diam. 200 mm
  • 45 mm for diam. 50 mm through diam. 150 mm
  • fragment chuck adapter for small pieces substrates – 10 mm – 50 mm
• Manual material dispensing:
  • triple syringe adapter (5 ml)
  • syringe adapter for EBR (Edge Bead Removal)
• Speed up to 12k rpm
• Acceleration up to 13k rpm
• Suitable for puddle development