Equipment Details
Wire bonder (automated)
Wire Bonder 3100plus
Wire bonder
Wire bonding
Assembly
Oerlikon ESEC Semiconductor
(kein Bild verfügbar - no image available)
Wire bonding with gold wires (or othe wires suitable for ball-wedge bonding)
- Wire diameter: 17,5 µm up to 50 µm on 2” reels
- Accuracy: 2,5 µm @ 3 sigma
- Ultrasonic frequency: 128 kHz
- Capillary length: 11,1 mm
- Substrate heating: up to 300°C
- Working area: 52 mm x 70 mm
- Substrate size: (125 mm up to 270 mm) x (15 mm up to 84 mm)
- Substrate thickness: 0,1 mm up to 0,8 (1,6) mm
WHB 131
Back to list