Equipment Details

Wire bonder (TS / BW)
F&K Delvotec 5410
Wire bonder
Wire bonding
Assembly
F&K Delvotec Bondtechnik GmbH
(kein Bild verfügbar - no image available)

Wire bonding with gold wires (or other wires suitable for ball-wedge bonding)

  • Wire diameter: 17,5 µm up to 50 µm on 2” reels
  • Ultrasonic power: 0 W up to 5 W
  • Ultrasonic frequency: 120 kHz
  • Bonding force: 15 cN up to 150 cN
  • Capillary length: 16 mm
  • Substrate heating: up to 300°C
  • Program memory
Döring, Sandra
T: (0351) 463 33468
WHB 131

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