Equipment Details

Placement of components on planar substrates

• High resolution head camera
• Vacuum sensor, force measuremenet, component sensor
• Integrated turntable per segment
• Control of substrate bow
• Single pick per component
• Nozzle changer, special nozzles
• High resolution head camera for 01005 passives, stationary fine pitch camera
• Component feeding from tape&reel and tray
• Collect and Place
  • Placement performance: 19.000 comp./h (accord. IPC 9850)
  • Components: passives 01005 up to 27 mm x 27 mm comp. size
  • Positioning accuracy in translation: +- 41 µm @ 3 sigma
  • Positioning accuracy in rotation: +- 0,4° @ 3 sigma
  • Adjustable placement force: 1 N to 10 N
• Pick and Place
  • Placement performance: ca. 3.000 comp./h
  • Components: passives 0402 up to 50 mm x 40 mm comp. size
  • Positioning accuracy in translation: +- 34 µm @ 3 sigma
  • Positioning accuracy in rotation: +- 0,2° @ 3 sigma
  • Adjustable placement force: 1 N to 10 N