Equipment Details
Placement system
Siplace SX 1
Automated placement system
Placement
Assembly
ASM Assembly Systems GmbH & Co. KG
Placement of components on planar substrates
- High resolution head camera
- Vacuum sensor, force measuremenet, component sensor
- Integrated turntable per segment
- Control of substrate bow
- Single pick per component
- Nozzle changer, special nozzles
- High resolution head camera for 01005 passives, stationary fine pitch camera
- Component feeding from tape&reel and tray
- Collect and Place
- Placement performance: 19.000 comp./h (accord. IPC 9850)
- Components: passives 01005 up to 27 mm x 27 mm comp. size
- Positioning accuracy in translation: +- 41 µm @ 3 sigma
- Positioning accuracy in rotation: +- 0,4° @ 3 sigma
- Adjustable placement force: 1 N to 10 N
- Pick and Place
- Placement performance: ca. 3.000 comp./h
- Components: passives 0402 up to 50 mm x 40 mm comp. size
- Positioning accuracy in translation: +- 34 µm @ 3 sigma
- Positioning accuracy in rotation: +- 0,2° @ 3 sigma
- Adjustable placement force: 1 N to 10 N
WHB E61
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