Equipment Details
Vapor phase / vacuum
Condenso
Soldering equipment
Curing
Soldering
Mass soldering
Rehm Thermal Systems
Vapor phase soldering of assembled SMD modules with and without vacuum step
- Max. substrate size 530 mm * 530 mm
- Available space in height +100/-20mm
- Max. soldering temperature 240°C
- Max. heating temperature 280°C
- Min. vacuum pressure 2 mBar
- Currently used fluid Galden 240
- Temperature profiling with max. 5 channels
WHB E61
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