Equipment Details

Topography Measurement
TDM compact II
Measurement equipment
Geometr. characterisation
Non-destructive evaluation
Insidix

Measurement of topography and deformation and its changing on flat objects under changing temperature conditions (e.g. simulation of soldering temperature profile up to 280°C, temperature cycles down to -50°C)

  • Objects up to (300 x 200) mm2
  • Infrared heating (max. temperature gradient 3K/s)
  • Active cooling (max. temperature gradient -1K/s)
  • Temperature range: -50°C ... 300°C
  • Accuracy z-direction: 1,5 µm repeatabilityt
  • Resolution vs. measurement area (FOV = Field of View)
    • 53 µm @ (195 x 155) mm²
    • 31 µm @ (110 x 90) mm²
    • 10 µm @ (37 x 30) mm²
    • 3 µm @ (12 x 10) mm²
Albrecht, Oliver
T: (0351) 463 36408
WHB E54

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