Equipment Details
Prober
PM8
Mask aligner
Measurement equipment
Electr. charaterisation
FormFactor
Probing and measuring of wafer, package and board level components, connections and contacts
- Substrate size: Wafer max. 8“ or rectangular substrate of max. 200 mm x 200 mm
- 4x manual positioning
- dig. camera system with revolver lens holder: 2x, 10x und 20x
- electrical measurement:
- Sourcemeter – Keithley 2401
- Device analyser - Keysight B1500A
- VNA – Anritsu ShockLine_MS46524B
- BERT & Sampling Oszilloscope - Anritsu BERTWave™ MP2100B
- anti-vibration table
WHB 133
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