Equipment Details

Probing and measuring of wafer, package and board level components, connections and contacts

• Substrate size: Wafer max. 8“ or rectangular substrate of max. 200 mm x 200 mm
• 4x manual positioning
• dig. camera system with revolver lens holder: 2x, 10x und 20x
• electrical measurement:
• Sourcemeter – Keithley 2401
• Device analyser - Keysight B1500A
• VNA – Anritsu ShockLine_MS46524B
• BERT & Sampling Oszilloscope - Anritsu BERTWave™ MP2100B
• anti-vibration table