Equipment Details
Electrodeposition unit 1
COMPACTA
Electrodeposition unit
Electroplating
Metallisation
Layer deposition
Bungard Elektronik GmbH & Co. KG
Manufacturing of vias in conductive covered isoalation materials (e.g. FR-4) and subsequent galvanic copper plating
Different chemical baths:
- Etching: NaPS/H2SO4
- Conditioning
- Activation: colloidal palladium/polymer activator
- Reduction
- Galvanic copper
WHB 163
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