Equipment Details
Wire bonder (semi automatic)
F&K Delvotec 56xx
Wire bonder
Wire bonding
Assembly
F&K Delvotec Bondtechnik GmbH
(kein Bild verfügbar - no image available)
- Bonding head 5610 (Ball-Wedge):
- Wire bonding with gold wires (or other wires suitable for ball-wedge bonding)
- Wire bonding with copper wires
- Bonding head 5632DA (Wedge-Wedge):
- Wire bonding with aluminum wires (or other wires suitable for wedge-wedge bonding)
- Ribbon bonding
- Exchangeable bonding head (5610 and 5632DA availabe)
- Substrate heating: up to 300°C
- Programmable automatic process
- Frequency adjustable corresponding to used bonding head
- Working area (XY): 100 x 100 mm²
- Bonding force: 0 cN up to 300 cN (resolution 1 cN)
- Bonding head 5610:
- Wire diameter: 17,5 µm up to 50 µm
- Ultrasonic power: 0 W up to 5 W
- Capillary length: 16 mm
- Bonding head 5632DA:
- Wire diameter: 17,5 µm up to 75 µm
- Ribbons: max. 250 µm x 30 µm
- Ultrasonic power: 0 W up to 5 W
- Tool length: 25 mm
WHB 131
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