Equipment Details

Wire bonder (semi automatic)
F&K Delvotec 56xx
Wire bonder
Wire bonding
Assembly
F&K Delvotec Bondtechnik GmbH
(kein Bild verfügbar - no image available)
  • Bonding head 5610 (Ball-Wedge):
    • Wire bonding with gold wires (or other wires suitable for ball-wedge bonding)
    • Wire bonding with copper wires
  • Bonding head 5632DA (Wedge-Wedge):
    • Wire bonding with aluminum wires (or other wires suitable for wedge-wedge bonding)
    • Ribbon bonding
  • Exchangeable bonding head (5610 and 5632DA availabe)
  • Substrate heating: up to 300°C
  • Programmable automatic process
  • Frequency adjustable corresponding to used bonding head
  • Working area (XY): 100 x 100 mm²
  • Bonding force: 0 cN up to 300 cN (resolution 1 cN)
  • Bonding head 5610:
    • Wire diameter: 17,5 µm up to 50 µm
    • Ultrasonic power: 0 W up to 5 W
    • Capillary length: 16 mm
  • Bonding head 5632DA:
    • Wire diameter: 17,5 µm up to 75 µm
    • Ribbons: max. 250 µm x 30 µm
    • Ultrasonic power: 0 W up to 5 W
    • Tool length: 25 mm
Döring, Sandra
T: (0351) 463 33468
WHB 131

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