Equipment Details
Die bonder
Fineplacer
Assembly equipment
Die bonding
Assembly
Finetech GmbH & Co. KG
(kein Bild verfügbar - no image available)
Face down placement of components and dies (flip chip), optional simultaneously soldering or curing of adhesives by temperature
- Component heater
- Substrate heater
- Positioning: manually, using microscope
WHB 131
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