Equipment Details

Die bonder
Fineplacer
Assembly equipment
Die bonding
Assembly
Finetech GmbH & Co. KG
(kein Bild verfügbar - no image available)

Face down placement of components and dies (flip chip), optional simultaneously soldering or curing of adhesives by temperature

  • Component heater
  • Substrate heater
  • Positioning: manually, using microscope
Ernst, Daniel, Dipl.-Ing.
T: (0351) 463 36941
WHB 131

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