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Übersicht Geräte

Bezeichnung
Gerätetyp
Hersteller
3D printer
Formlabs Form 1+
Formlabs
3D Measurement Equipment
PMC 500
Mahr
3D Topometry
µSurf
NanoFocus
Agarose gel electrophoresis
PerfectBlue Gelsystem MiniS
Peqlab
Etching equipment
T210
Pill GmbH
Autoklave
Autoklav DB23
Systec
Exposurer
EXP 8000
Bungard Elektronik GmbH & Co. KG
Placement system
Siplace SX 1
ASM Assembly Systems GmbH & Co. KG
Furnace ATV
ATV PEO-630
ATV Technologie GmbH
Brushing Equipment
RBM
Bungard Elektronik GmbH & Co. KG
Die bonder
Fineplacer
Finetech GmbH & Co. KG
Die bonder
Fineplacer Lambda
Finetech GmbH & Co. KG
Vapor phase / vacuum
Condenso
Rehm Thermal Systems
Thick wire bonder
Orthodyne
Orthodyne Wedge Bonders
Digital microscope Olympus
DXS 1000
Olympus / Evident
Dispensing equipment
T2000
Dr. Tresky AG
Wire bonder (semi automatic)
F&K Delvotec 56xx
F&K Delvotec Bondtechnik GmbH
Wire bonder (TS / BW)
F&K Delvotec 5410
F&K Delvotec Bondtechnik GmbH
Wirebonder (US / WW)
F&K Delvotec 5430
F&K Delvotec Bondtechnik GmbH
Wire bonder (automated)
Wire Bonder 3100plus
Oerlikon ESEC Semiconductor
Developing equipment
T209
Pill GmbH
Fine line plotter
MIVA 26100
MIVA Technologies GmbH
Fabrication Tools
Hotplate, Spincoater, UV-Cleaner
MBraun
Humidity temperature storage
VCL 0006
Vötsch
Film developer
RAPILINE 43SP
Agfa
Photo plotter
MIVA 1600
MIVA Technologies GmbH
Mill drill plotter
CCD
Bungard Elektronik GmbH & Co. KG
IBS (IonBeamSputtering) deposition chamber
Creaphys
MBraun / Creaphys
Electrodeposition unit 1
COMPACTA
Bungard Elektronik GmbH & Co. KG
Electrodeposition unit 2
COMPACTA
Bungard Elektronik GmbH & Co. KG
Contact angle measurment equipment
OCA 20
DataPhysics Instruments GmbH
Convection soldering equipment
Vision 8 V2.1
Rehm Thermal Systems GmbH
Laminator 1
RLM 419
Bungard Elektronik GmbH & Co. KG
Laminator 2
RLM 419
Bungard Elektronik GmbH & Co. KG
Laser treatment
microCUTms10.6
3D micromac
Light soldering equiment
ATN
ATN
Mask Aligner
EVG 640
EV Group
Microscope
DM 4000 M
Leica
Multi layer press
MP20-V
HML Haseneder Maschinenbau
NanoFrazor
NANOFRAZOR SCHOLAR
Heidelberg Instruments
Surface measurement
µScan AF2000
NanoFocus
PCR equipment
Biostep Prime Thermocycler
OMNILAB Laborzentrum GmbH & Co. KG
Plasma equipment
Dreva Clean 450
VTD Vakuumtechnik Dresden GmbH
Precision saw
Buehler Isomet 1000
ITW Test & Measurement GmbH
Prober
PM8
FormFactor
Pull shear tester
Dage 4000
Dage Holdings Ltd.
Pull shear tester
Condor Sigma
XYZtec
Rheometer
HAAKE RheoStress 600
ThermoFischer Scientific
X-ray CT
nanotom
GE Sensing & Inspection Technologies GmbH
X-ray microscope
nanome|x
GE Sensing & Inspection Technologies GmbH
Mask printer
EKRA X3
Asys Automatisierungssysteme GmbH
Grinding and polishing system
TegraPol/TegraForce
Struers
Shaker
V455/6 - PA 1000L
Brüel & Kjaer
SIR measurement
SIR-O-Mat
IAVT
Spin coater
Spin Processor Laurell WS-650Mz-8NPP
Laurell Technologies Corp.
Aseptic workbench
HERA SAFE KS 15
Thermo Scientific
Stylus Profilometer
DekTakXTA
DekTak
Temperature high cycle storage
TSK 200
Feutron
Temperature low cycle storage
TPK 600
Feutron
Thermoshaker
TSC Thermoshaker
Analytik Jena
Topography Measurement
TDM compact II
Insidix
Transfer Microscope
Nikon DS-Ri2
Nikon, Graphene Industries
Acoustic microscope
C-SAM Gen6
Sonoscan Inc.
Test uint electromigration
Versuchsstand
IAVT
Vibration polisher
Buehler Vibromet 2
ITW Test & Measurement GmbH
Wafer saw
ESEC Dicing Saw 8003
ESEC
Wave soldering equipment
GoWave
SEHO Systems GmbH
Centrifuge
Micro Star 12EU
VWR