Gerätedetails

Placement system
Siplace SX 1
Automated placement system
Placement
Assembly
ASM Assembly Systems GmbH & Co. KG

Placement of components on planar substrates

  • High resolution head camera
  • Vacuum sensor, force measuremenet, component sensor
  • Integrated turntable per segment
  • Control of substrate bow
  • Single pick per component
  • Nozzle changer, special nozzles
  • High resolution head camera for 01005 passives, stationary fine pitch camera
  • Component feeding from tape&reel and tray
  • Collect and Place
    • Placement performance: 19.000 comp./h (accord. IPC 9850)
    • Components: passives 01005 up to 27 mm x 27 mm comp. size
    • Positioning accuracy in translation: +- 41 µm @ 3 sigma
    • Positioning accuracy in rotation: +- 0,4° @ 3 sigma
    • Adjustable placement force: 1 N to 10 N
  • Pick and Place
    • Placement performance: ca. 3.000 comp./h
    • Components: passives 0402 up to 50 mm x 40 mm comp. size
    • Positioning accuracy in translation: +- 34 µm @ 3 sigma
    • Positioning accuracy in rotation: +- 0,2° @ 3 sigma
    • Adjustable placement force: 1 N to 10 N
Schaulin, Michael, Dr.-Ing.
T: (0351) 463 31695
WHB E61

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