Gerätedetails

Vapor phase / vacuum
Condenso
Soldering equipment
Curing
Soldering
Mass soldering
Rehm Thermal Systems

Vapor phase soldering of assembled SMD modules with and without vacuum step

  • Max. substrate size 530 mm * 530 mm
  • Available space in height +100/-20mm
  • Max. soldering temperature 240°C
  • Max. heating temperature 280°C
  • Min. vacuum pressure 2 mBar
  • Currently used fluid Galden 240
  • Temperature profiling with max. 5 channels
Wohlrabe, Heinz, Dr.-Ing. habil.
T: (0351) 463 35479
WHB E61

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