Equipment Details

Laser treatment
microCUTms10.6
Laser
Labeling
Drilling
Material treatment
Scribing
Cutting
3D micromac
  • Drilling, cutting of ceramics, polymers and metal foils
  • Trimming of thick film resistors, functional trimming
  • Labeling and marking of different materials
  • CO2 laser 200 Watt (wavelength 10,6 μm)
  • Ytterbium fiber laser 20 Watt (λ = 1,06 μm) with scanner objectiv lens 130 mm x 130 mm
  • Working area: 400 mm x 400 mm
  • Repeatability: 10 μm
  • Camera for workholder positioning
  • Import of customers data files in DXF or HPGL format
Luniak, Marco, Dr.-Ing.
T: (0351) 463 32478
WHB E61

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