Gerätedetails

Plasma equipment
Dreva Clean 450
Plasma equipment
Material treatment
Surface modification
VTD Vakuumtechnik Dresden GmbH
(kein Bild verfügbar - no image available)
  • Activating surfaces using oxygen / air / argon (argon+oxygen) / argon-hydrogen / tetrafluormethane-oxygen, t=(0,5 - 30) min
  • Surface etching using oxygen and tetrafluormethane / depends on material that shall be etched (condition: material has to be changed to gas phase by process gas), t=(3 - 60) min
  • Surface cleaning using oxygen / argon / hydrogen / hydrogen+argon / oxygen+argon / purigon, t=(0,5 - 20) min
  • Coating using methane, acetylene, hexafluorethane, octafluorcyclobutane, hexamethyldisiloxane, (process gas = monomeree), t=(5 - 60) min
  • Low pressure plasma equipment with RF excitation (f=13,56 MHz)
  • Process duration (tmax=30 min) and plasma power (Pmax=600 W) adjustable
  • Booster pump 65 m³/h, chemcal resistant with oil vapor seperator
  • Pressure control with butterfly throttle valve, (0,1 - 1) mbar
  • Working pressure p=(20-80) Pa
  • 2 MFC for 2 gases, 500 sccm each, mix ratio adjustable
  • Process gases: O2, Ar, CF4, N2
  • Chamber size (450 x 450 x 500) mm, max. substrate size (300 x 260) mm á 10 pieces stacked

Selection of characteristic applications

  • Preconditioning surfaces for adhesive bonding: generating an hydrophilic layer.
    • Process gases O2 + Ar,
    • Plasma power 400 W,
    • Pressure: (25-30) Pa,
    • Duration: approx. 1 min.

 

  • Lotus effect: generating an hydrophobic layer
    • Process gas: O2,
    • Plasma power 400 W,
    • Pressure: (25-30) Pa,
    • Duration: approx. 1 min.

 

  • Preconditioning of components before soldering:
    • Process gas CF4 + (O2 / air)
    • Plasma power 400 W,
    • Pressure: (25-35) Pa,
    • Duration: (10 min)

 

  • Cleaning of Au bondpads:
    • Process gases Ar / O2,
    • Plasma power (75-100) W / 300 W
    • Pressure: 26 Pa / 100 Pa
    • Duration: 5 min / 3 min.
Schumann, Frank
T: (0351) 463 36408
WHB E61a

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