Gerätedetails
Wire bonder (TS / BW)
F&K Delvotec 5410
Wire bonder
Wire bonding
Assembly
F&K Delvotec Bondtechnik GmbH
(kein Bild verfügbar - no image available)
Wire bonding with gold wires (or other wires suitable for ball-wedge bonding)
- Wire diameter: 17,5 µm up to 50 µm on 2” reels
- Ultrasonic power: 0 W up to 5 W
- Ultrasonic frequency: 120 kHz
- Bonding force: 15 cN up to 150 cN
- Capillary length: 16 mm
- Substrate heating: up to 300°C
- Program memory
WHB 131
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