Equipment Details

Die bonder
Fineplacer Lambda
Assembly equipment
Placement
Die bonding
Assembly
Finetech GmbH & Co. KG
(kein Bild verfügbar - no image available)

Face down placement of components and dies (flip chip):

  • Thermo compression bonding
  • Ultrasonic and thermosonic bonding
  • Adheseve bonding
  • Automated processing
  • Camera system for positioning and process observation
  • Force adjustment: 0,5 up to 60 N (20 N with ultrasonic head)
  • Positioning accuracy: 0,5 µm
  • Component size: 0,1 mm up to 15 mm edge length
  • Component heating: max. 400°C
  • Substrate heating: max. 400°C
  • Ultrasonic frequency: 60 kHz
  • Ultrasonic power: max. 20W
  • Amplitude approx. 2 µm
Ernst, Daniel, Dipl.-Ing.
T: (0351) 463 36941
WHB 131

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