Gerätedetails

Wire bonding with gold wires (or othe wires suitable for ball-wedge bonding)

• Wire diameter: 17,5 µm up to 50 µm on 2” reels
• Accuracy: 2,5 µm @ 3 sigma
• Ultrasonic frequency: 128 kHz
• Capillary length: 11,1 mm
• Substrate heating: up to 300°C
• Working area: 52 mm x 70 mm
• Substrate size: (125 mm up to 270 mm) x (15 mm up to 84 mm)
• Substrate thickness: 0,1 mm up to 0,8 (1,6) mm