Gerätedetails

Curing and sintering of ceramic materials

• Temperature range: 250-1100 °C (below 250°C temperature only can be adjusted imprecisely)
• Max. heating rate: 50 K/min
• Max. cooling rate (above 500°C): 50 K/min
• Max. substrat size: 200x270 mm²
• Available atmospheres: air, nitrogen (both with 0-10 or 10-50 slm)
• Accessories:
  • Planar substrate holder 200x200 mm²
  • Magazine for 10 substrates 204x204 mm²
  • Al2O3 setter plates 202x270 mm² (thickness 1mm; used to insert LTCC laminates smaller substrates into the 10x magazine)
  • High voltage bushing 7,5 kV (via exhaust)
  • 5 thermocouples to determine temperature distribution in the furnace