Gerätedetails

Electrodeposition unit 1
COMPACTA
Electrodeposition unit
Electroplating
Metallisation
Layer deposition
Bungard Elektronik GmbH & Co. KG

Manufacturing of vias in conductive covered isoalation materials (e.g. FR-4) and subsequent galvanic copper plating

Different chemical baths:

  • Etching: NaPS/H2SO4
  • Conditioning
  • Activation: colloidal palladium/polymer activator
  • Reduction
  • Galvanic copper
Hielscher, Gerald, Dr.-Ing.
T: (0351) 463 32159
WHB 163

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