Gerätedetails

Electrodeposition unit 2
COMPACTA
Electrodeposition unit
Electroplating
Metallisation
Layer deposition
Bungard Elektronik GmbH & Co. KG

Different baths for copper treatment

  • Acid cleaning
  • Micro etching: NaPS/H2SO4
  • Organic surface protection ENTEK Plus HT
  • Chemical tin: SANNATECH
  • Black oxyde
Hielscher, Gerald, Dr.-Ing.
T: (0351) 463 32159
WHB 163

Back to list
⇑
>> Impressum