Gerätedetails

Measurement of topography and deformation and its changing on flat objects under changing temperature conditions (e.g. simulation of soldering temperature profile up to 280°C, temperature cycles down to -60°C)

• Objects up to (300 x 200) mm²
• Infrared heating (max. temperature gradient 3K/s)
• Active cooling (max. temperature gradient -3K/s)
• Temperature range: max. 280°C
• Accuracy z-direction: 1,5 µm repeatabilityt
• Resolution vs. measurement area (FOV = Field of View)
  • 75 µm @ (150 x 187) mm²
  • 40 µm @ (80 x 100) mm²
  • 15 µm @ (30 x 37) mm²
  • 5 µm @ (10 x 12) mm²