Gerätedetails

Measurement of topography and deformation and its changing on flat objects under changing temperature conditions (e.g. simulation of soldering temperature profile up to 280°C, temperature cycles down to -50°C)

• Objects up to (300 x 200) mm²
• Infrared heating (max. temperature gradient 3K/s)
• Active cooling (max. temperature gradient -1K/s)
• Temperature range: -50°C ... 300°C
• Accuracy z-direction: 1,5 µm repeatabilityt
• Resolution vs. measurement area (FOV = Field of View)
  • 53 µm @ (195 x 155) mm²
  • 31 µm @ (110 x 90) mm²
  • 10 µm @ (37 x 30) mm²
  • 3 µm @ (12 x 10) mm²