Gerätedetails
Topography Measurement
TDM compact II
Measurement equipment
Geometr. characterisation
Non-destructive evaluation
Insidix

Measurement of topography and deformation and its changing on flat objects under changing temperature conditions (e.g. simulation of soldering temperature profile up to 280°C, temperature cycles down to -60°C)
- Objects up to (300 x 200) mm2
- Infrared heating (max. temperature gradient 3K/s)
- Active cooling (max. temperature gradient -3K/s)
- Temperature range: max. 280°C
- Accuracy z-direction: 1,5 µm repeatabilityt
- Resolution vs. measurement area (FOV = Field of View)
- 75 µm @ (150 x 187) mm²
- 40 µm @ (80 x 100) mm²
- 15 µm @ (30 x 37) mm²
- 5 µm @ (10 x 12) mm²
WHB E54
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