Gerätedetails

Topography Measurement
TDM compact II
Measurement equipment
Geometr. characterisation
Non-destructive evaluation
Insidix

Measurement of topography and deformation and its changing on flat objects under changing temperature conditions (e.g. simulation of soldering temperature profile up to 280°C, temperature cycles down to -60°C)

  • Objects up to (300 x 200) mm2
  • Infrared heating (max. temperature gradient 3K/s)
  • Active cooling (max. temperature gradient -3K/s)
  • Temperature range: max. 280°C
  • Accuracy z-direction: 1,5 µm repeatabilityt
  • Resolution vs. measurement area (FOV = Field of View)
    • 75 µm @ (150 x 187) mm²
    • 40 µm @ (80 x 100) mm²
    • 15 µm @ (30 x 37) mm²
    • 5 µm @ (10 x 12) mm²
Albrecht, Oliver
T: (0351) 463 36408
WHB E54

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