Gerätedetails

Wafer saw
ESEC Dicing Saw 8003
Precision saw
Sawing
Cutting
ESEC
(kein Bild verfügbar - no image available)

Separation of silicon, ceramic or glass substrates by friction sawing as well as geometrical structuring of substrates (v-groove)

  • Wafer thickness: 10-5000 µm
  • Wafer size: up to 6“ (circular or rectangular)
  • Rotation speed of the sawing blade: (10000…40000) RPM
  • Available adapters: (48, 52, 53, 54) mm
  • Sawing blade: throwless or throw-type
  • Accuracy horizontal: 1 µm
  • Accuracy in height: (5…10) µm
  • Accuracy angle: 0,01°
Lorenz, Lukas, Dipl.-Ing.
T: (0351) 463 43767
WHB E33

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